Английская Википедия:Chiplet
Шаблон:Short description A chiplet[1][2][3][4] is a tiny integrated circuit (IC) that contains a well-defined subset of functionality. It is designed to be combined with other chiplets on an interposer in a single package. A set of chiplets can be implemented in a mix-and-match "Lego-like" assembly. This provides several advantages over a traditional system on chip (SoC):
- Reusable IP (intellectual property):[5] the same chiplet can be used in many different devices
- Heterogeneous integration:[6] chiplets can be fabricated with different processes, materials, and nodes, each optimized for its particular function
- Known good die:[7] chiplets can be tested before assembly, improving the yield of the final device
Multiple chiplets working together in a single integrated circuit may be called a multi-chip module, hybrid IC, 2.5D IC, or an advanced package.
Chiplets may be connected with standards such as UCIe, bunch of wires (BoW), OpenHBI, and OIF XSR.
The term was coined by University of California, Berkeley professor John Wawrzynek as a component of the RAMP Project (research accelerator for multiple processors) in 2006 [8][9] extension for the Department of Energy, as was RISC-V architecture.
Common examples include:
- Intel Meteor Lake
- AMD Ryzen based on Zen 4 and later architecture
- NVidia H100
See also
References
Further reading
- ↑ Шаблон:Cite web
- ↑ Шаблон:Cite web
- ↑ Semi Engineering "Chiplets" Retrieved 5 December 2022
- ↑ Don Scansen, EE Times "Chiplets: A Short History Retrieved 5 December 2022
- ↑ Шаблон:Cite web
- ↑ Шаблон:Cite web
- ↑ Шаблон:Cite book
- ↑ Шаблон:Cite book
- ↑ Шаблон:Cite journal