Английская Википедия:Dicing saw

Материал из Онлайн справочника
Перейти к навигацииПерейти к поиску

Шаблон:Short description Шаблон:More references

Thibaut Diamond wire saw
Diamond wire saw in stone industry

A dicing saw is a kind of saw which employs a high-speed spindle fitted with an extremely thin diamond blade or diamond wire[1] to dice, cut, or groove semiconductor wafers, and glass, ceramic, crystal, and many other types of material.

The thickness of the cutting blades used varies with the material being cut, and is of about 20 μm to 35 μm when cutting silicon wafersШаблон:Citation needed. Japanese companies, such as DISCO Corporation and Accretech (Tokyo Seimitsu), account for about 90% of dicing saw salesШаблон:Citation needed. In the past, cutting 1/2 to 2/3 of wafer thickness was the mainstream; with large diameter wafers on dicing tape, full cut cutting is becoming mainstreamШаблон:Citation needed.

See also

References

Шаблон:Reflist


Шаблон:Tool-stub