Английская Википедия:Disco Corporation

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Шаблон:Infobox company

Шаблон:Nihongo is a Japanese precision tools maker, especially for the semiconductor production industry.

The company makes dicing saws and laser saws to cut semiconductor silicon wafers and other materials; grinders to process silicon and compound semiconductor wafers to ultra-thin levels; polishing machines to remove the grinding damage layer from the wafer back-side and to increase chip strength.[1]

Файл:06 西面全景.jpg
The company's Kuwabata plant in Kure, Hiroshima

History

The company was founded as Daiichi-Seitosho in May 1937, as an industrial abrasive wheel manufacturer.[2]

After World War II Japan faced a construction boom which also helped DISCO to boost its sales. The company's grinder discs were in high demand from utility companies, which needed them to manufacture watt-meters.[3]

In December 1968 the company developed and released an ultra-thin resinoid cutting wheel, Microncut. The wheel contained diamond powder and as a result it was capable of making sharp, precision cuts as demanded in the semiconductor manufacturing process. There were no cutting machines available in the market on which ultra-thin precision wheels could be mounted and run, DISCO decided to develop its own machine in 1975. The cutting machine, DAD-2h, received instant recognition from semiconductor companies, including Texas Instruments.[2]

The company adopted the name of DISCO Corporation in May 1977,[2] was listed with the Japan Securities Dealers' Association in October 1989, and entered the First Section of the Tokyo Stock Exchange in December 1999.Шаблон:Citation needed

References

Шаблон:Reflist

External links

Шаблон:Portal

  1. Ошибка цитирования Неверный тег <ref>; для сносок Nikkei не указан текст
  2. 2,0 2,1 2,2 Шаблон:Cite book
  3. Шаблон:Cite book