Английская Википедия:IEEE Rao R. Tummala Electronics Packaging Award

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Шаблон:Short descriptionThe IEEE Electronics Packaging Award, formerly called the IEEE Components, Packaging, and Manufacturing Technologies Award, is a Technical Field Award established by the IEEE Board of Directors in 2002. It is awarded for meritorious contribution to the advancement of components, electronic packaging or manufacturing technologies.

The award may be presented to an individual or a team of up to three recipients.

Recipients of this award receive a bronze medal, certificate and an honorarium.

Recipients

Recipients of the award for each year include: Шаблон:Col-begin Шаблон:Col-break

  • 2021: Chin C. Lee
  • 2020: Mitsumasa Koyanagi and Peter Ramm
  • 2019: Ephraim Suhir
  • 2018: William Chen
  • 2017: Paul S. Ho and King-Ning Tu
  • 2016: Michael Pecht
  • 2015: Nasser Borozorg-Grayeli
  • 2014: Avram Bar-Cohen
  • 2013: John Lau
  • 2012: Mauro Walker[1]
  • 2011: Rao R. Tummala[2][3]
  • 2010: Herbert Reichl[4][5]
  • 2009: George G. Harman[6]

Шаблон:Col-break

  • 2008: Karl Puttlitz and Paul A. Totta
  • 2007: Dimitry Grabbe
  • 2006: C. P. Wong[7]
  • 2005: Yutaka Tsukada
  • 2004: John W. Balde

Шаблон:Col-end

References

Шаблон:Reflist

External links

Шаблон:List of IEEE awards


Шаблон:Sci-award-stub