Английская Википедия:Exynos

Logo of Samsung Exynos (stylized as SΛMSUNG Exynos)

Файл:Samsung-Exynos-4412-Quad SoC used in I9300.jpg

An Exynos 4 Quad (4412), on the circuit board of a Samsung Galaxy S III smartphone

Exynos, formerly Hummingbird (Шаблон:Korean), is a series of ARM-based system-on-chips developed by Samsung Electronics' System LSI division and manufactured by Samsung Foundry. It is a continuation of Samsung's earlier S3C, S5L and S5P line of SoCs.

Exynos is mostly based on the ARM Cortex cores with the exception of some high end SoCs which featured Samsung's proprietary "M" series core design; though from 2021 onwards even the flagship high-end SoC's will be featuring ARM Cortex cores.^[1]

History

Шаблон:See also

In 2010, Samsung launched the Hummingbird S5PC110 (now Exynos 3 Single) in its Samsung Galaxy S smartphone, which featured a licensed ARM Cortex-A8 CPU.^[2] This ARM Cortex-A8 was code-named Hummingbird. It was developed in partnership with Intrinsity using their FastCore and Fast14 technology.^[3]

In early 2011, Samsung first launched the Exynos 4210 SoC in its Samsung Galaxy S II mobile smartphone. The driver code for the Exynos 4210 was made available in the Linux kernel^[4] and support was added in version 3.2 in November 2011.^[5]^[6]

On 29 September 2011, Samsung introduced Exynos 4212^[7] as a successor to the 4210; it features a higher clock frequency and "50 percent higher 3D graphics performance over the previous processor generation".^[8] Built with a 32 nm high-κ metal gate (HKMG) low-power process; it promises a "30 percent lower power-level over the previous process generation".

On 30 November 2011, Samsung released information about their upcoming SoC with a dual-core ARM Cortex-A15 CPU, which was initially named "Exynos 5250" and was later renamed to Exynos 5 Dual. This SoC has a memory interface providing 12.8 GB/s of memory bandwidth, support for USB 3.0 and SATA 3, can decode full 1080p video at 60 fps along with simultaneously displaying WQXGA-resolution (2560 × 1600) on a mobile display as well as 1080p over HDMI.^[9] This SoC was used in some Chromebooks from 2013. Samsung Exynos 5 Dual has been used in a 2015 prototype supercomputer,^[10] while the end-product will use a chip meant for servers from another vendor.

On 26 April 2012, Samsung released the Exynos 4 Quad, which powers the Samsung Galaxy S III and Samsung Galaxy Note II.^[11] The Exynos 4 Quad SoC uses 20% less power than the SoC in Samsung Galaxy S II. Samsung also changed the name of several SoCs, Exynos 3110 to Exynos 3 Single, Exynos 4210 and 4212 to Exynos 4 Dual 45 nm,^[12] and Exynos 4 Dual 32 nm^[13] and Exynos 5250 to Exynos 5 Dual.

On 2010 Samsung founded a design center in Austin called Samsung's Austin R&D Center (SARC). Samsung has hired many ex-AMD, ex-Intel, ex-ARM and various other industry veterans.^[14] The SARC develop high-performance, low-power, complex CPU and System IP (Coherent Interconnect and memory controller) architectures and designs.^[15] In 2012, Samsung began development of GPU IP called "S-GPU".^[16] After a three-year design cycle, SARC's first custom CPU core called the M1 was released in the Exynos 8890 in 2016.^[17] In 2017 the San Jose Advanced Computing Lab (ACL) was opened to continue custom GPU IP development.^[14] Samsung's custom CPU cores were named Mongoose for four generations, named M1 through M4, and Exynos SoCs with such cores were never on par in power efficiency or performance with their Qualcomm Snapdragon equivalents.^[18]^[19]

On 3 June 2019, AMD and Samsung announced a multi-year strategic partnership in mobile graphics IP based on AMD Radeon GPU IP.^[20]^[16] NotebookCheck reported that Samsung are targeting 2021 for their first SoC with AMD Radeon GPU IP.^[21] However, AnandTech reported 2022.^[22] In August 2019, during AMD's Q2 2019 earnings call, AMD stated that Samsung plans to launch SoCs with AMD graphics IP in roughly two years.^[23] The first SoC to use Radeon GPU were Exynos 2200, introduced in January 2022, with a custom Xclipse 920 based on AMD's RDNA 2 microarchitecture.^[24]

On 1 October 2019, rumors emerged that Samsung had laid off their custom CPU core teams at SARC.^[25]^[26]^[27] On 1 November 2019, Samsung filed a WARN letter with the Texas Workforce Commission, notifying of upcoming layoffs of their SARC CPU team and termination of their custom CPU core development.^[28] SARC and ACL will still continue development of custom SoC, AI, and GPU.^[29]

In June 2021, Samsung hired engineers from AMD and Apple to form a new custom architecture team.^[30]

In October 2021, Google released their Pixel 6 series of phones based on Google's Tensor SoC, which was made in collaboration with Samsung.^[31]

Current Exynos SoCs (2020–present)

Starting in 2020 Samsung introduced a new series of Exynos SoCs with lower numbers than in the past. This indicates a cut between the past Exynos SoCs at least in naming.

Exynos 800 series

SoC			CPU		GPU			Memory technology			AI accelerator	Modem	Connectivity	Released	Devices using
Model number	Fab.	Die size (mm²)	ISA	µarch	µarch	Frequency (MHz)	Performance GFLOPS (FP32)	Type	Bus width (bit)	Bandwidth (GB/s)	AI accelerator	Modem	Connectivity	Released	Devices using
Exynos 850 (S5E3830)^[32]	8 nm LPP		ARMv8.2-A	8 cores 2.0 GHz Cortex-A55	Mali-G52 MP1	1000		LPDDR4X			-	Shannon 318 LTE Cat.7 2CA 300Mbit/s (DL) / Cat.13 2CA 150Mbit/s (UL)	Bluetooth 5.0, Wi-Fi 802.11a/b/g/n/ac	Q2 2020	Samsung Galaxy A04s Samsung Galaxy A12 (SM-A127x) Samsung Galaxy A13 (SM-A135x) Samsung Galaxy A14 (SM-A145F) Samsung Galaxy A21s Samsung Galaxy M12/F12 Samsung Galaxy M13/F13 Samsung Galaxy Xcover 5
Exynos 880 (S5E8805)^[33]	8 nm LPP		ARMv8.2-A	2 + 6 cores (2.0 GHz Cortex-A77 + 1.8 GHz Cortex-A55)	Mali-G76 MP5			LPDDR4X			NPU	Shannon 5G LTE DL: Cat.16 1000 Mbit/s, 5CA, 256-QAM UL: Cat.18 200 Mbit/s, 2CA, 256-QAM 5G NR Sub-6 GHz DL: 2.55Gbit/s UL: 1.28Gbit/s	Bluetooth 5.0, Wi-Fi 802.11a/b/g/n/ac	Q2 2020	Vivo Y51s Vivo Y70s Vivo Y70t

Exynos 900 series

SoC			CPU		GPU			Memory technology			AI accelerator	Modem	Connectivity	Released	Devices using
Model number	Fab.	Die size (mm²)	ISA	µarch	µarch	Frequency (MHz)	Performance GFLOPS (FP32)	Type	Bus width (bit)	Bandwidth (GB/s)	AI accelerator	Modem	Connectivity	Released	Devices using
Exynos 980 (S5E9630)^[34]	8 nm LPP		ARMv8.2-A	2 + 6 cores (2.2 GHz Cortex-A77 + 1.8 GHz Cortex-A55)	Mali G76 MP5	728	262	LPDDR4X	64-bit (4×16-bit) Quad-channel	2133 MHz (34.128GB/s)	Single core NPU and DSP ? MAC units @ ?	Shannon 5188 5G LTE DL: Cat.16 1000 Mbit/s, 5CA, 256-QAM UL: Cat.18 200 Mbit/s, 2CA, 256-QAM 5G NR Sub-6 GHz DL: 2.55Gbit/s UL: 1.28Gbit/s	Bluetooth 5.0, Wi-Fi 802.11a/b/g/n/ac/ax	Q4 2019	Шаблон:Collapsible list
Exynos 990 (S5E9830)^[35]	7 nm LPP (EUV)	91.83^[36]	ARMv8.2-A	2 + 2 + 4 cores (2.73 GHz Exynos M5 "Lion" + 2.6 GHz Cortex-A76 + 2.11 GHz Cortex-A55) 2MB System Cache	Mali G77 MP11	832	1,205	LPDDR5	64-bit (4×16-bit) Quad-channel	2750 MHz (44GB/s)	Dual-core NPU ? MAC units @ ? DSP (15 TOPs)	Paired with Exynos Modem 5123 LTE DL: Cat.24 3000 Mbit/s, 8CA, 1024-QAM UL: Cat.22 422 Mbit/s, 2CA, 256-QAM 5G NR Sub-6 GHz DL: 5.1Gbit/s UL: ?Gbps 5G NR mmWave DL: 7.35Gbit/s UL: ?Gbps	Bluetooth 5.0, Wi-Fi 802.11a/b/g/n/ac/ax	Q1 2020	Шаблон:Collapsible list

Exynos 1000 series

Exynos 1080

5nm (5LPE) Samsung process
CPU features
- 1 + 3 + 4 cores (2.8 GHz Cortex-A78 + 2.6 GHz Cortex-A78 + 2.0 GHz Cortex-A55)
GPU features
- Mali G78 MP10
- Vulkan 1.2
DSP features
- Multi Format Codec (MFC) video acceleration for H.265/HEVC, H.264, VP9
- HDR10+
ISP features
- -
Modem and wireless features
- Bluetooth 5.2 (from 5.0 on Exynos 990)
- Exynos Modem Integrated^[37]
- LTE Category 24/18
- 6CA, 256-QAM
- 5G NR Sub-6 (DL = 5100 Mbit/s and UL = 1920 Mbit/s)
- 5G NR mmWave (DL = 7350 Mbit/s and UL = 3670 Mbit/s)

SoC			CPU		GPU			Memory technology			AI accelerator	Modem	Connectivity	Released	Devices using
Model number	Fab.	Die size (mm²)	ISA	µarch	µarch	Frequency (MHz)	Performance GFLOPS (FP32)	Type	Bus width (bit)	Bandwidth (GB/s)	AI accelerator	Modem	Connectivity	Released	Devices using
Exynos 1080 (S5E9815)^[38]	5 nm LPE (EUV)		ARMv8.2-A	1 + 3 + 4 cores (2.8 GHz Cortex-A78 + 2.6 GHz Cortex-A78 + 2.0 GHz Cortex-A55)	Mali G78 MP10	800	1,024	LPDDR4X LPDDR5	64-bit (4×16-bit) Quad-channel	2133 MHz (34.128GB/s) 2750 MHz (44GB/s)	NPU + DSP (5.7 TOPs)	LTE DL: Cat.18 1200 Mbit/s, 6CA, 256-QAM UL: Cat.18 200 Mbit/s, 2CA, 256-QAM 5G NR Sub-6 GHz DL: 5.1Gbit/s UL: 1.28Gbit/s 5G NR mmWave DL: 3.67Gbit/s UL: 3.67Gbit/s	Bluetooth 5.2, Wi-Fi 802.11a/b/g/n/ac/ax	Q4 2020	Шаблон:Collapsible list
Exynos 1280 (S5E8825)^[39]				2 + 6 cores (2.4 GHz Cortex-A78 + 2.0 GHz Cortex-A55)	Mali-G68 MP4	900		LPDDR4X			NPU (4.3 TOPs)	Shannon 5G LTE DL: Cat.18 1.2 Gbit/s, 6CA, 256-QAM UL: Cat.18 200 Mbit/s, 2CA, 256-QAM 5G NR Sub-6 GHz DL: 2.55Gbit/s UL: 1.28Gbit/s 5G NR mmWave DL: 1.84 Gbit/s UL: 0.92 Gbit/s	Bluetooth 5.2, Wi-Fi 802.11a/b/g/n/ac	Q1 2022	Шаблон:Collapsible list
Exynos 1330 (S5E8535)^[40]				2 + 6 cores (2.4 GHz Cortex-A78 + 2.0 GHz Cortex-A55)	Mali G68 MP2	950		LPDDR4X LPDDR5				5G NR Sub-6GHz 2.55Gbps (DL) / 1.28Gbps (UL) LTE Cat.18 6CC (DL) / Cat.18 2CC (UL)	Bluetooth 5.2, Wi-Fi 802.11a/b/g/n/ac, GPS, GLONASS, BeiDou, Galileo	Q1 2023	Шаблон:Collapsible list
Exynos 1380 (S5E8835)^[41]				4 + 4 cores (2.4 GHz Cortex-A78 + 2.0 GHz Cortex-A55)	Mali G68 MP5	950	608	LPDDR4X LPDDR5			NPU (4.9 TOPs)	5G NR Sub-6GHz 3.79Gbps (DL) / 1.28 Gbps (UL) 5G NR mmWave 3.67Gbps (DL) / 0.92 Gbps (UL) LTE Cat.18 1.2Gbps (DL) / Cat.18 211Mbps (UL)	Bluetooth 5.2, Wi-Fi 802.11a/b/g/n/ac/ax, GPS, GLONASS, BeiDou, Galileo	Q1 2023	Шаблон:Collapsible list

Exynos 2000 series

Exynos 2100

5nm (5LPE) Samsung process^[42]
6MB System Level Cache (SLC)
CPU features
- 1 + 3 + 4 cores (2.91 GHz Cortex-X1 + 2.81 GHz Cortex-A78 + 2.2 GHz Cortex-A55)
- 19% better perf on single thread^[43]
- 33% better perf on multi threads^[44]
GPU features
- Mali G78 MP14 at 854 MHz
- 40% better perf^[45]
- Vulkan 1.2
DSP features
- 8K30 & 4K120 encode & 8K60 decode
- Add support of AV1 in 8K60 (decode support claimed, however not implemented, thus this claim is unverified)^[46]^[47]
- Multi Format Codec (MFC) video acceleration for H.265/HEVC, H.264, VP9^[48]
- HDR10+
ISP features
- Single: 200MP or Dual: 32MP+32MP^[49]
- Up to quad simultaneous camera^[50]
Modem and wireless features
- Bluetooth 5.2 (from 5.0 on Exynos 990)
- Exynos Modem Integrated^[37]
- LTE Category 24/18
- 6CA, 256-QAM
- 5G NR Sub-6 (DL = 5100 Mbit/s and UL = 1920 Mbit/s)
- 5G NR mmWave (DL = 7350 Mbit/s and UL = 3670 Mbit/s)
Single band GNSS support: GPS, Galileo, GLONASS, BeiDou

Exynos 2200

4nm (4LPE) Samsung process
8MB System Level Cache (SLC)
CPU features^[51]^[52]
- 1 + 3 + 4 cores (2.8 GHz Cortex-X2 + 2.5 GHz Cortex-A710 + 1.9 GHz Cortex-A510)
- 1 MB + 3x 512KB + 2x 256KB L2
- 4MB L3
GPU features
- Xclipse 920 at 1306 MHz (RDNA 2 384:24:24:63 WGP, 1MB L2)^[51]^[52]
- Ray tracing (Hardware based)

Exynos 2400

CPU features
- 1.7x increase in CPU performance compared to Exynos 2200
GPU features
- Xclipse 940 (RDNA 3)
- Ray tracing (Hardware based)
NPU features
- 14.7x boost in AI performance compared to Exynos 2200

SoC			CPU		GPU			Memory technology			AI accelerator	Modem	Connectivity	Released	Devices using
Model number	Fab.	Die size (mm²)	ISA	µarch	µarch	Frequency (MHz)	Performance GFLOPS (FP32)	Type	Bus width (bit)	Bandwidth (GB/s)	AI accelerator	Modem	Connectivity	Released	Devices using
Exynos 2100 (S5E9840)^[53]	5 nm LPE (EUV)		ARMv8.2-A	1 + 3 + 4 cores (2.91 GHz Cortex-X1 + 2.81 GHz Cortex-A78 + 2.2 GHz Cortex-A55)	Mali G78 MP14	854	1,530	LPDDR5	64-bit (4×16-bit) Quad-channel	3200 MHz (51.2GB/s)	Triple NPU + DSP (26 TOPs)	LTE DL: Cat.24 3000 Mbit/s, 8CA, 1024-QAM UL: Cat.18 422 Mbit/s, 4CA, 256-QAM 5G NR Sub-6 GHz DL: 5.1Gbit/s UL: 1.92Gbit/s 5G NR mmWave DL: 7.35Gbit/s UL: 3.67Gbit/s	Bluetooth 5.2, Wi-Fi 802.11a/b/g/n/ac/ax	Q1 2021	Шаблон:Collapsible list
Exynos 2200 (S5E9925)^[54]	4 nm (4LPE) (EUV)	99.9^[51]	ARMv9.0-A	1 + 3 + 4 cores (2.8 GHz Cortex-X2 + 2.52 GHz Cortex-A710 + 1.82 GHz Cortex-A510)	Xclipse 920 (RDNA 2 384:24:24:6 3 WGP^[51])Шаблон:Efn	1306	1,003	LPDDR5		3200 MHz (51.2GB/s)	Dual NPU + DSP	LTE DL: Cat.24 3000 Mbit/s, 8CA, 1024-QAM UL: Cat.22 422 Mbit/s, 4CA, 256-QAM 5G NR Sub-6 GHz DL: 5.1 Gbit/s UL: 2.55 Gbit/s 5G NR mmWave DL: 7.35 Gbit/s UL: 3.67 Gbit/s	Bluetooth 5.2, Wi-Fi 802.11a/b/g/n/ac/ax	Q1 2022	Шаблон:Collapsible list
Exynos 2400 (S5E9945)^[55]^[56]	4 nm (4LPP+) (EUV)	Шаблон:Unk	ARMv9.2-A	1 + 2 + 3 + 4 cores (3.2 GHz Cortex-X4 + 2.9 GHz Cortex-A720 + 2.6 GHz Cortex-A720 + 1.95 GHz Cortex-A520)	Xclipse 940 (RDNA 3) 768:48:32:12 6 WGP)Шаблон:Efn	1109	3,407	LPDDR5X		Шаблон:Unk	NPU + DSP	LTE DL: Cat.24 3000 Mbit/s, 8CA, 1024-QAM UL: Cat.22 422 Mbit/s, 4CA, 256-QAM 5G NR Sub-6 GHz DL: 9.64 Gbit/s UL: 2.55 Gbit/s 5G NR mmWave DL: 12.1 Gbit/s UL: 3.67 Gbit/s	Шаблон:Unk	Q1 2024	Шаблон:Collapsible list

Шаблон:Notelist

Past Exynos SoCs (2010–2019)

SoC			CPU		GPU			Memory technology			AI accelerator	Modem	Connectivity	Released	Devices using
Model number	Fab.	Die size (mm²)	ISA	µarch	µarch	Frequency (MHz)	Performance (GFLOPS)	Type	Bus width (bit)	Bandwidth (GB/s)	AI accelerator	Modem	Connectivity	Released	Devices using
Exynos 3 Single 3110^[57] (previously Hummingbird S5PC110)	45 nm		ARMv7	1 core 1.2 GHz Cortex-A8	PowerVR SGX540	200	3.2^[58]	LPDDR, LPDDR2 or DDR2	64-bit (2x32-bit) Dual-channel	200 MHz	rowspan=33 Шаблон:N/A			Q2 2010	Шаблон:Collapsible list
Exynos 3 Quad 3470^[59]	28 nm			4 cores 1.4 GHz Cortex-A7	Mali-400 MP4	450	16.2	LPDDR3	64-bit (2×32-bit) Dual-channel				Q3 2014	Шаблон:Collapsible list
Exynos 3 Quad 3475	28 nm HKMG			4 cores 1.3 GHz Cortex-A7	Mali-T720	600	10.2	LPDDR3					Q3 2015	Шаблон:Collapsible list
Exynos 4 Dual 4210^[60]^[12]	45 nm			2 cores 1.4 GHz Cortex-A9	Mali-400 MP4	266	9.6	LPDDR2, DDR2 or DDR3	64-bit (2×32-bit) Dual-channel	400 MHz (6.4 GB/s)^[61]^[62]^[63]^[64]			Q2 2011	Шаблон:Collapsible list
Exynos 4 Dual 4212^[60]^[13]	32 nm HKMG			2 cores 1.5 GHz Cortex-A9		400^[65]	14.4						Q1 2012	Шаблон:Collapsible list
Exynos 4 Quad 4412^[66]^[63]	32 nm HKMG			4 cores 1.6 GHz Cortex-A9		400–533^[67]	15.84						Q2 2012	Шаблон:Collapsible list
Exynos 4 Quad 4415^[66]^[63]	28 nm HKMG			4 cores 1.5 GHz Cortex-A9		533^[68]	19.2						Q3 2014^[68]	Шаблон:Collapsible list
Exynos 5 Dual 5250^[69]^[70]	32 nm HKMG			2 cores 1.7 GHz Cortex-A15	Mali-T604 MP4^[71]	533	68.224Шаблон:Citation needed	LPDDR2, LPDDR3 or DDR3	64-bit (2×32-bit) Dual-channel	800 MHz (12.8 GB/s)			Q3 2012^[69]	Шаблон:Collapsible list
Exynos 5 Hexa 5260^[72]^[73]	28 nm HKMG			2+4 cores (1.7 GHz Cortex-A15 + 1.3 GHz Cortex-A7)	Mali-T624 MP4	600	76.8 (FP32)	LPDDR3	64-bit (2×32-bit) Dual-channel	800 MHz (12.8 GB/s)			Q2 2014	Шаблон:Collapsible list
Exynos 5 Octa 5410^[74]^[75]^[76]^[77]				4+4 cores (1.6 GHz Cortex-A15 + 1.2 GHz Cortex-A7)	PowerVR SGX544 MP3	480–532^[78]	49	LPDDR3	64-bit (2×32-bit) Dual-channel	800 MHz (12.8 GB/s)			Q2 2013	Шаблон:Collapsible list
Exynos 5 Octa 5420^[79]		136.96		4+4 cores (1.9 GHz Cortex-A15 + 1.3 GHz Cortex-A7)	Mali-T628 MP6	533	102.4 (FP32)	LPDDR3e	64-bit (2×32-bit) Dual-channel	933 MHz (14.9 GB/s)			Q3 2013	Шаблон:Collapsible list
Exynos 5 Octa 5422^[72]^[80]				4+4 cores (2.1 GHz Cortex-A15 + 1.5 GHz Cortex-A7)		533	102.4 (FP32)	LPDDR3e	64-bit (2×32-bit) Dual-channel	933 MHz (14.9 GB/s)			Q2 2014	Шаблон:Collapsible list
Exynos 5 Octa 5430^[81]^[82]	20 nm HKMG	110.18		4+4 cores (1.8 GHz Cortex-A15 + 1.3 GHz Cortex-A7)		600	115.2 (FP32)	LPDDR3e/DDR3	64-bit (2×32-bit) Dual-channel	1066 MHz (17.0 GB/s)			Q3 2014	Шаблон:Collapsible list
Exynos 5 Octa 5800^[83]	28 nm HKMG			4+4 cores (2.0 GHz Cortex-A15 + 1.3 GHz Cortex-A7)		?	?	LPDDR3/DDR3	64-bit (2×32-bit) Dual-channel	933 MHz (14.9 GB/s)			Q2 2014	Шаблон:Collapsible list
Шаблон:AnchorExynos 7 Octa 5433^[84]^[85]^[86]	20 nm HKMG	113.42^[87]	ARMv8-A	4 + 4 cores (1.9 GHz Cortex-A57 + 1.3 GHz Cortex-A53) GTS	Mali-T760 MP6	700	142	LPDDR3	64-bit (2×32-bit) Dual-channel	825 MHz (13.2 GB/s)^[84]	Paired with Samsung M303/Intel XMM 7260 LTE Cat 6 (300Mbit/s) or Ericsson M7450 LTE Cat 4^[88]	Bluetooth, Wi-Fi	Q4 2014	Шаблон:Collapsible list
Exynos 7 Octa 7420^[89]^[90]^[91]	14 nm LPE	78.23^[87]		4 + 4 cores (2.1 GHz Cortex-A57 + 1.5 GHz Cortex-A53) GTS	Mali-T760 MP8	772	210	LPDDR4	64-bit (2×32-bit) Dual-channel	1553 MHz (24.88 GB/s)^[92]	Paired with Shannon 333 LTE Cat 9 (450Mbit/s)	Bluetooth, Wi-Fi	Q2 2015	Шаблон:Collapsible list
Exynos 7 Quad 7570^[93]^[94]^[95]	14 nm LPC			4 cores 1.4 GHz Cortex-A53	Mali-T720 MP1^[96]	830	19.1	LPDDR3	32-bit Single-channel	1066 MHz (4.2 GB/sec)	LTE Cat.4 2CA 150Mbit/s (DL) / 50Mbit/s (UL)	Bluetooth 4.2, Wi-Fi 802.11a/b/g/n	Q3 2016	Шаблон:Collapsible list
Exynos 7 Quad 7578	28 nm HKMG			4 cores 1.5 GHz Cortex-A53	Mali-T720 MP2	668	22.7				LTE Cat.4 2CA 150Mbit/s (DL) / 50Mbit/s (UL)	Bluetooth, Wi-Fi	Q2 2015	Шаблон:Collapsible list
Exynos 7 Octa 7580^[97]^[98]	28 nm HKMG			8 cores 1.6 GHz Cortex-A53	Mali-T720 MP2	668	22.7		64-bit (2×32-bit) Dual-channel	933 MHz (14.9 GB/sec)	LTE Cat.6 2CA 300Mbit/s (DL) / 50Mbit/s (UL)	Bluetooth, Wi-Fi	Q2 2015	Шаблон:Collapsible list
Exynos 7 Octa 7870^[99]^[100]	14 nm LPP			8 cores 1.6 GHz Cortex-A53	Mali-T830 MP1^[101]	700	23.8		32-bit Single-channel^[102]	933 MHz	LTE Cat.6 2CA 300Mbit/s (DL) / 50Mbit/s (UL)	Bluetooth, Wi-Fi	Q1 2016	Шаблон:Collapsible list
Exynos 7880^[103]^[104]^[105]	14 nm LPP			8 cores 1.9 GHz Cortex-A53	Mali-T830 MP3	950	71.4	LPDDR4	64-bit (2×32-bit) Dual-channel	1600 MHz (12.8 GB/sec)	LTE Cat.7 3CA 300Mbit/s (DL) / 2CA 100Mbit/s (UL)	Bluetooth, Wi-Fi	Q1 2017	Шаблон:Collapsible list
Exynos 7872^[106]	14 nm LPP			2 + 4 cores (2.0 GHz Cortex-A73 + 1.6 GHz Cortex-A53) GTS	Mali-G71 MP1	1200	41	LPDDR3	32-bit Single-channel	933 MHz (3.7 GB/sec)	LTE Cat.7 2CA 300Mbit/s (DL) / Cat.13 2CA 150Mbit/s (UL)	Bluetooth 4.2, Wi-Fi 802.11a/b/g/n	Q1 2018	Meizu M6s
Exynos 7884A^[107]				2 + 6 cores (1.35 GHz Cortex-A73 + 1.35 GHz Cortex-A53) GTS	Mali-G71 MP2	Шаблон:Unk		LPDDR3	64-bit (2×32-bit) Dual-channel		LTE Cat.4 2CA 150Mbit/s (DL) / 2CA 50Mbit/s (UL)	Bluetooth 4.2, Wi-Fi 802.11a/b/g/n	Q3 2018	Шаблон:Collapsible list
Exynos 7884^[108]				2 + 6 cores (1.6 GHz Cortex-A73 + 1.35 GHz Cortex-A53) GTS		770	53	LPDDR4	64-bit (2×32-bit) Dual-channel		Shannon 327 LTE Cat.12 3CA 600Mbit/s (DL) / Cat.13 2CA 150Mbit/s (UL)	Bluetooth 5.0, Wi-Fi 802.11a/b/g/n/ac	Q2 2018	Шаблон:Collapsible list
Exynos 7885^[109]^[110]				2 + 6 cores (2.2 GHz Cortex-A73 + 1.6 GHz Cortex-A53) GTS		1100	76		32bit (2×16-bit) Dual-channel	1866 MHz (7.5 GB/sec)			Q1 2018	Шаблон:Collapsible list
Exynos 7904^[111]				2 + 6 cores (1.8 GHz Cortex-A73 + 1.6 GHz Cortex-A53) GTS		770	53		64-bit (2×32-bit) Dual-channel				Q1 2019	Шаблон:Collapsible list
Шаблон:AnchorExynos 8 Octa 8890 ^[112]	14 nm LPP			4 + 4 cores (2.3 GHz, up to 2.6 GHz in dual-core load, Exynos M1 "Mongoose" + 1.6 GHz Cortex-A53) GTS	Mali-T880 MP12	650	265.2	LPDDR4	64-bit (2×32-bit) Dual-channel		Shannon 335 LTE DL: LTE Cat 12 600Mbit/s, 3CA UL: LTE Cat 13 150Mbit/s, 2CA	Bluetooth 4.2, Wi-Fi 802.11a/b/g/n/ac	Q1 2016	Шаблон:Collapsible list
Шаблон:AnchorExynos 8 Octa 8890 ^[112]	14 nm LPP			4 + 4 cores (2.0 GHz Exynos M1 "Mongoose" + 1.5 GHz Cortex-A53) GTS	Mali-T880 MP10 (Lite)	650	221	LPDDR4				Bluetooth 4.2, Wi-Fi 802.11a/b/g/n/ac	Q1 2016	Шаблон:Collapsible list
Exynos 8895 ^[113]^[114]^[115]	10 nm LPE	103.64^[116]		4 + 4 cores (2.314 GHz Exynos M2 "Mongoose" + 1.69 GHz Cortex-A53) GTS	Mali-G71 MP20	546^[117]	375	LPDDR4X		1794 MHz (28.7 GB/s)^[118]^[119]	Shannon 355 LTE DL: LTE Cat 16 1050Mbit/s, 5CA, 256-QAM) UL: LTE Cat 13 150Mbit/s, 2CA, 64-QAM	Bluetooth 5.0, Wi-Fi 802.11a/b/g/n/ac	Q2 2017	Шаблон:Collapsible list
Exynos 9609^[120]	10 nm LPE^[121]			4 + 4 cores (2.2 GHz Cortex-A73 + 1.6 GHz Cortex-A53)	Mali-G72 MP3			LPDDR4X	32-bit (2×16-bit) Dual-channel	1600 MHz (11.9 GB/sec)	Shannon 337 LTE Cat.12 3CA 600Mbit/s (DL) / Cat.13 2CA 150Mbit/s (UL)	Bluetooth 5.0, Wi-Fi 802.11a/b/g/n/ac	Q2 2019	Шаблон:Collapsible list
Exynos 9610^[122]				4 + 4 cores (2.3 GHz Cortex-A73 + 1.7 GHz Cortex-A53)									Q4 2018	Samsung Galaxy A50
Exynos 9611^[123]				4 + 4 cores (2.3 GHz Cortex-A73 + 1.7 GHz Cortex-A53)		850	92						Q3 2019	Шаблон:Collapsible list
Exynos 9810 (S5E9810)^[124]^[125]	10 nm LPP	118.94^[126]	ARMv8.2-A	4 + 4 cores (2.9 GHz Exynos M3 "Meerkat"^[116] + 1.9 GHz Cortex-A55)	Mali-G72 MP18	572	370^[127]	LPDDR4X	64-bit (4×16-bit) Quad-channel	1794 MHz (28.7Шаблон:NbspGB/s)^[118]	Shannon 360 LTE DL: LTE Cat 18 1200 Mbit/s, 6CA, 256-QAM UL: LTE Cat 13 200 Mbit/s, 2CA, 256-QAM	Bluetooth 5.0, Wi-Fi 802.11a/b/g/n/ac	Q1 2018	Шаблон:Collapsible list
Exynos 9820 (S5E9820)^[128]	8 nm LPP	127^[129]		2 + 2 + 4 cores (2.73 GHz Exynos M4 "Cheetah" + 2.31 GHz Cortex-A75 + 1.95 GHz Cortex-A55)	Mali G76 MP12	702	607			2093 MHz (33.488GB/s) ^[129]	Dual-core NPU 1024 MAC units @ 933 MHz^[129] (1.86 TOPs)	Shannon 5000 LTE DL: Cat.20 2000 Mbit/s, 8CA, 256-QAM UL: Cat.13 316 Mbit/s, 3CA, 256-QAM	Bluetooth 5.0, Wi-Fi 802.11a/b/g/n/ac/ax	Q1 2019	Шаблон:Collapsible list
Exynos 9825 (S5E9825)^[130]	7 nm (EUV)			2 + 2 + 4 cores (2.73 GHz Exynos M4 "Cheetah" + 2.4 GHz Cortex-A75 + 1.95 GHz Cortex-A55)	Mali G76 MP12	754	652			2093 MHz (33.488GB/s) ^[129]	Dual-core NPU 1024 MAC units @ 933 MHz^[129] (1.86 TOPs)		Bluetooth 5.0, Wi-Fi 802.11a/b/g/n/ac/ax	Q3 2019	Шаблон:Collapsible list

List of Exynos Wearable SoCs

SoC			CPU		GPU			Memory technology			AI accelerator	Modem	Connectivity	Released	Devices using
Model number	Fab.	Die size (mm²)	ISA	µarch	µarch	Frequency (MHz)	Performance GFLOPS (FP32)	Type	Bus width (bit)	Bandwidth (GB/s)	AI accelerator	Modem	Connectivity	Released	Devices using
Exynos 4 Single 4212^[60]^[13]	32 nm HKMG		ARMv7-A	1 core 0.8 GHz Cortex-A9	Mali-400 MP4	400^[131]	14.4	LPDDR2, DDR2 or DDR3	64-bit (2×32-bit) Dual-channel	400 MHz (6.4 GB/s)	rowspan=6 Шаблон:N/A			Q3 2013	Шаблон:Collapsible list
Exynos 2 Dual 3250	28 nm HKMG		ARMv7-A	2 cores 1.0 GHz Cortex-A7	Mali-400 MP2	400	7.2						Q2 2014	Шаблон:Collapsible list
Exynos 7 Dual 7270^[132]	14 nm LPP		ARMv8-A	2 cores 1.0 GHz Cortex-A53	Mali-T720 MP1	667 MHz	15.3	LPDDR3	64-bit (2×32-bit) Dual-channel	25.6	LTE Cat.4 2CA 150 Mbit/s (DL) / 50 Mbit/s (UL)	Bluetooth 4.2, Wi-Fi 4, GPS, GLONASS, BeiDou, Galileo, eMMC	Q3 2016	Шаблон:Collapsible list
Exynos 9110^[133]	10 nm LPP		ARMv8-A	2 cores 1.15 GHz Cortex-A53	Mali-T720 MP1	667 MHz	15.3	LPDDR4 LPDDR4X	Шаблон:Unk	Шаблон:Unk	LTE Cat.4 2CA 150 Mbit/s (DL) / Cat.5 75 Mbit/s (UL)	Bluetooth 4.2, Wi-Fi 4, GPS, GLONASS, BeiDou, Galileo, eMMC	Q3 2018	Шаблон:Collapsible list
Exynos W920^[134]	5 nm LPE (S5E)		ARMv8.2-A	2 cores 1.18 GHz Cortex-A55	Mali-G68 MP2	Шаблон:Unk	Шаблон:Unk	LPDDR4	Шаблон:Unk	Шаблон:Unk		Bluetooth 5.0, Wi-Fi 4, GPS, GLONASS, BeiDou, Galileo, eMMC 5.1	Q3 2021	Шаблон:Collapsible list
Exynos W930^[135]	5 nm LPP (SF5)		ARMv8.2-A	2 cores 1.4 GHz Cortex-A55	Mali-G68 MP2	Шаблон:Unk	Шаблон:Unk	LPDDR4	Шаблон:Unk	Шаблон:Unk		Bluetooth 5.2, Wi-Fi 4, GPS, GLONASS, BeiDou, Galileo, eMMC 5.1	Q3 2023	Шаблон:Collapsible list

List of Exynos modems

Exynos Modem 303

Supported modes LTE FDD, LTE TDD, WCDMA and GSM/EDGE
LTE Cat. 6
Downlink: 2CA 300Mbit/s 64-QAM
Uplink: 100Mbit/s 16-QAM
28 nm HKMG Process
Paired with: Exynos 5 Octa 5430 and Exynos 7 Octa 5433
Devices using: Samsung Galaxy Note 4, Samsung Galaxy Note Edge and Samsung Galaxy Alpha^[136]

Exynos Modem 333

Supported modes LTE FDD, LTE TDD, WCDMA, TD-SCDMA and GSM/EDGE
LTE Cat. 10
Downlink: 3CA 450Mbit/s 64-QAM
Uplink: 2CA 100Mbit/s 16-QAM
28 nm HKMG Process
Paired with: Exynos 7 Octa 7420
Devices using: Samsung Galaxy S6, Samsung Galaxy Note 5 and Samsung Galaxy A8 (2016)^[137]

Exynos Modem 5100

Supported Modes: 5G NR Sub-6 GHz, 5G NR mmWave, LTE-FDD, LTE-TDD, HSPA, TD-SCDMA, WCDMA, CDMA, GSM/EDGE^[138]
Downlink Features:
- 8CA (Carrier Aggregation) in 5G NR
- 8CA 1.6Gbit/s in LTE Cat. 19
- 4x4 MIMO
- FD-MIMO
- Up to 256-QAM in sub-6 GHz, 2Gbit/s
- Up to 64-QAM in mmWave, 6Gbit/s
Uplink Features:
- 2CA (Carrier Aggregation) in 5G NR
- 2CA in LTE
- Up to 256-QAM in sub-6 GHz
- Up to 64-QAM in mmWave
Process: 10 nm FinFET Process
Paired with: Exynos 9820 and Exynos 9825
Devices using: Samsung Galaxy S10 and Samsung Galaxy Note 10

Exynos Modem 5123

Supported Modes: 5G NR Sub-6 GHz, 5G NR mmWave, LTE-FDD, LTE-TDD, HSPA, TD-SCDMA, WCDMA, CDMA, GSM/EDGE^[139]
Downlink Features:
- 8CA 3.0Gbit/s in LTE Cat. 24
- Up to 256-QAM in sub-6 GHz, 5.1Gbit/s
- Up to 64-QAM in mmWave, 7.35Gbit/s
Uplink Features:
- 2CA 422 Mbit/s in LTE Cat. 22
- Up to 256-QAM in sub-6 GHz
- Up to 64-QAM in mmWave
Process: 7 nm FinFET Process
Paired with: Exynos 990, Exynos 2100, Exynos 2200, Google Tensor
Devices using: Samsung Galaxy S20, Samsung Galaxy Note 20, Samsung Galaxy S21, Samsung Galaxy S22, and Google Pixel 6

Exynos Modem 5300

Supported Modes: 3GPP Release 16 5G NR Sub-6 GHz & mmWave (SA/NSA), LTE-FDD, LTE-TDD, HSPA, TD-SCDMA, WCDMA, CDMA, GSM/EDGE^[140]
Downlink Features:
- 5G sub-6 GHz
  - Up to 256-QAM
  - 4x4 MIMO
  - 200 MHz carrier aggregation
- 5G mmWave
  - Up to 64-QAM
  - 2x2 MIMO
  - 800 MHz carrier aggregation
Uplink Features:
- 5G sub-6 GHz
  - Up to 256-QAM
  - 2x2 MIMO
  - 400 MHz carrier aggregation
- 5G mmWave
  - Up to 64-QAM
  - 2x2 MIMO
  - 800 MHz carrier aggregation
Process: 4nm EUV
Devices using: Google Pixel 7 and Google Pixel 8

List of Exynos IoT SoCs

Exynos i T200^[141]

CPU: Cortex-M4 @ 320 MHz, Cortex-M0+ @ 320 MHz
WiFi: 802.11b/g/n Single band (2.4 GHz)
On-chip Memory: SRAM 1.4MB
Interface: SDIO/ I2C/ SPI/ UART/ PWM/ I2S
Front-end Module: Integrated T/R switch, Power Amplifier, Low Noise Amplifier
Security: WEP 64/128, WPA, WPA2, AES, TKIP, WAPI, PUF (Physically Unclonable Function)

Exynos i S111^[142]

CPU: Cortex-M7 200 MHz
Modem: LTE Release 14 NB-IoT
- Downlink: 127 kbit/s
- Uplink: 158 kbit/s
On-chip Memory: SRAM 512KB
Interface: USI, UART, I2C, GPIO, eSIM I/F, SDIO(Host), QSPI(Single/Dual/Quad IO mode), SMC
Security: eFuse, AES, SHA-2, PKA, Secure Storage, Security Sub-System, PUF
GNSS: GPS, Galileo, GLONASS, BeiDou

List of Exynos Automotive SoCs

Exynos Auto series

SoC			CPU	GPU			Memory technology			AI accelerator	Modem	Connectivity	Released	Vehicles
Model number	Fab.	Die size (mm²)	CPU	µarch	Frequency (MHz)	Performance GFLOPS (FP32)	Type	Bus width (bit)	Bandwidth (GB/s)	AI accelerator	Modem	Connectivity	Released	Vehicles
Exynos Auto 8890 (SGA8890A)^[143]	[[14 nm process\|14Шаблон:Nbspnm]] LPP		4 + 4 cores (2.3 GHz, up to 2.6 GHz in single-core load, Exynos M1 "Mongoose" + 1.6 GHz Cortex-A53) GTS (ARMv8-A)	Mali-T880 MP12	650	265.2	LPDDR4	64-bit (2×32-bit) Dual-channel		N/A	Shannon LTE DL: LTE Cat 12 600Шаблон:NbspMbit/s, 3CA UL: LTE Cat 13 150Шаблон:NbspMbit/s, 2CA	Bluetooth 4.2, Wi-Fi 802.11a/b/g/n/ac	Q1 2017	Audi A4 (B9) (2019–present)
Exynos Auto T5123^[144]			2 cores Cortex-A55 (ARMv8.2-A)				LPDDR4X			N/A	LTE DL: Cat.24 3000 Mbit/s, 8CA, 1024-QAM UL: Cat.22 422 Mbit/s, 2CA, 256-QAM 5G NR Sub-6 GHz DL: 4.55Gbit/s UL: 1.92Gbps		Q4 2021
Exynos Auto V7^[145]	[[10 nm process\|8Шаблон:Nbspnm]] LPP		8 cores 1.5 GHz Cortex-A76 (ARMv8.2-A)	2× Mali G76 (MP8 + MP3)			LPDDR4X LPDDR5	128-bit (4×32-bit) Quad-channel	2133 MHz (68.256GB/s)	NPU			Q4 2021
Exynos Auto V9 (S5AHR80A)^[146]	[[10 nm process\|8Шаблон:Nbspnm]] LPP		8 cores 2.1 GHz Cortex-A76 (ARMv8.2-A)	3× Mali G76 (MP12 + MP3 + MP3)			LPDDR4X LPDDR5			NPU, 8.5 TOPS		Bluetooth 5.0, Wi-Fi 6	Q1 2019
Exynos Auto V920 (S5AV920)^[147]	5 nm LPE		10 cores (4+4+2) ARM Cortex-A78AE	Samsung Xclipse GPU			LPDDR5	128-bit (4×32-bit) Quad-channel	3200 MHz (102.4GB/s)	NPU, 23.1 TOPS			2025

The Exynos Auto V9 comes with additional features such as:

Automotive Safety Integrity Level (ASIL)-B standards
Safety island core
4× Tensilica HiFi 4 DSP
Supports up to 6 displays, and up to 12 camera connections (4/4/4 MIPI CSI)
Supports 4096x4096 120fps encoding and decoding with HEVC(H.265)
2x Gb Ethernet^[148]

The Exynos Auto V920 comes with additional features such as:

3× Tensilica HiFi 5 DSP
Supports up to 6 Displays (3x 5K (8K*2K) + 3x DFHD (3840*1440)), and up to 12 Cameras (3x MIPI CSI 4lanes)
Supports 4K 240fps decoding (HEVC), 4K 120fps encoding
2x USXGMII (10Gbps) Ethernet^[147]

Similar platforms

Шаблон:Div col

A-Series by Allwinner
Apple silicon (A/S/T/W/H/U/M series) by Apple Inc.
Kirin by HiSilicon (Huawei)
i.MX by NXP
Jaguar and Puma by AMD
MT by MediaTek
NovaThor by ST-Ericsson
OMAP by Texas Instruments
RK by Rockchip Electronics
Snapdragon by Qualcomm
Tegra by Nvidia

Шаблон:Div col end

References

Шаблон:Reflist

External links

Шаблон:Application ARM-based chips Шаблон:Samsung Electronics

[1] Шаблон:Cite web

[2] Шаблон:Cite web

[3] Шаблон:Cite press release

[4] Шаблон:Cite web

[5] Шаблон:Cite web

[6] Шаблон:Cite web

[7] Шаблон:Cite web

[8] Шаблон:Cite web

[9] Шаблон:Cite web

[10] Шаблон:Cite web

[11] Шаблон:Cite web

[autogenerated3-12] 12,0 ^12,1 Шаблон:Cite web

[autogenerated1-13] 13,0 ^13,1 ^13,2 Шаблон:Cite web

[:2-14] 14,0 ^14,1 Шаблон:Cite web

[15] Шаблон:Cite web

[:4-16] 16,0 ^16,1 Шаблон:Cite web

[17] Шаблон:Cite web

[18] Шаблон:Cite web

[19] Шаблон:Cite web

[20] Шаблон:Cite web

[21] Шаблон:Cite web

[22] Шаблон:Cite web

[23] Шаблон:Cite web

[24] Шаблон:Cite web

[25] Шаблон:Cite web

[26] Шаблон:Cite web

[27] Шаблон:Cite web

[28] Шаблон:Cite web

[29] Шаблон:Cite web

[sammobile-30] Шаблон:Cite web

[31] Шаблон:Cite web

[32] Шаблон:Cite web

[33] Шаблон:Cite web

[34] Шаблон:Cite web

[:5-35] Шаблон:Cite web

[36] Шаблон:Cite web

[:6-37] 37,0 ^37,1 Шаблон:Cite web

[38] Шаблон:Cite web

[39] Шаблон:Cite web

[40] Шаблон:Cite web

[41] Шаблон:Cite web

[42] Шаблон:Cite web

[43] Шаблон:Cite web

[44] Шаблон:Cite web

[45] Шаблон:Cite web

[46] Шаблон:Cite web

[47] Шаблон:Cite web

[48] Шаблон:Cite web

[49] Шаблон:Cite web

[50] Шаблон:Cite web

[:8-51] 51,0 ^51,1 ^51,2 ^51,3 Шаблон:Cite web

[:9-52] 52,0 ^52,1 Шаблон:Citation

[53] Шаблон:Cite web

[54] Шаблон:Cite web

[55] Шаблон:Cite web

[56] Шаблон:Cite web

[57] Шаблон:Cite web

[58] Шаблон:Cite web

[59] Шаблон:Cite web

[4212page-60] 60,0 ^60,1 ^60,2 Шаблон:Cite web

[61] Шаблон:Cite web

[62] Шаблон:Cite web

[SE4Quad-63] 63,0 ^63,1 ^63,2 Шаблон:Cite web

[64] Шаблон:Cite web

[65] Шаблон:Cite web

[SGSIII-66] 66,0 ^66,1 Шаблон:Cite web

[4412Manual-67] Шаблон:Cite web

[4415Manual-68] 68,0 ^68,1 Шаблон:Cite web

[Samsung_Cortex-A15-69] 69,0 ^69,1 Шаблон:Cite web

[70] Шаблон:Cite web

[71] Шаблон:Cite web

[samsung-unveils-mwc-72] 72,0 ^72,1 Шаблон:Cite web

[73] Шаблон:Cite web

[74] Шаблон:Cite web

[75] Шаблон:Cite web

[76] Шаблон:Cite web

[77] Шаблон:Cite web

[78] Шаблон:Cite web

[79] Шаблон:Cite web

[80] Шаблон:Cite web

[81] Шаблон:Cite web

[82] Шаблон:Cite web

[83] Шаблон:Cite web

[AnandTech-84] 84,0 ^84,1 Шаблон:Cite web

[85] Шаблон:Cite mailing list

[86] Шаблон:Cite web

[:0-87] 87,0 ^87,1 Шаблон:Cite web

[88] Шаблон:Cite web

[89] Шаблон:Cite web

[90] Шаблон:Cite web

[91] Шаблон:Cite web

[92] Шаблон:Cite web

[93] Шаблон:Cite news

[94] Шаблон:Cite web

[95] Шаблон:Cite web

[96] Шаблон:Cite web

[97] Шаблон:Cite web

[98] Шаблон:Cite web

[99] Шаблон:Cite web

[100] Шаблон:Cite web

[101] Шаблон:Cite web

[102] Шаблон:Cite web

[103] Шаблон:Cite web

[104] Шаблон:Cite web

[105] Шаблон:Cite web

[106] Шаблон:Cite web

[107] Шаблон:Cite web

[108] Шаблон:Cite web

[109] Шаблон:Cite web

[110] Шаблон:Cite web

[111] Шаблон:Cite web

[112] Шаблон:Cite web

[113] Шаблон:Cite web

[114] Шаблон:Cite web

[115] Шаблон:Cite press release

[:1-116] 116,0 ^116,1 Шаблон:Cite web

[117] Шаблон:Cite web

[AT_9810-118] 118,0 ^118,1 Шаблон:Cite news

[119] Шаблон:Cite web

[120] Шаблон:Cite web

[121] Шаблон:Cite web

[122] Шаблон:Cite web

[123] Шаблон:Cite web

[124] Шаблон:Cite web

[125] Шаблон:Cite web

[126] Шаблон:Cite web

[127] Шаблон:Cite web

[128] Шаблон:Cite web

[:3-129] 129,0 ^129,1 ^129,2 Шаблон:Cite web

[130] Шаблон:Cite web

[131] Шаблон:Cite web

[132] Шаблон:Cite web

[133] Шаблон:Cite web

[134] Шаблон:Cite web

[135] Шаблон:Cite web

[136] Шаблон:Cite web

[137] Шаблон:Cite web

[138] Шаблон:Cite web

[Exynos_5123-139] Шаблон:Cite web

[Exynos_5300-140] Шаблон:Cite web

[141] Шаблон:Cite web

[142] Шаблон:Cite web

[143] Шаблон:Cite web

[144] Шаблон:Cite web

[AutoV7-145] Шаблон:Cite web

[AutoV9-146] Шаблон:Cite web

[:7-147] 147,0 ^147,1 Шаблон:Cite web

[148] Шаблон:Cite web

[1]

[2]

[3]

[4]

[5]

[6]

[7]

[8]

[9]

[10]

[11]

[12]

[13]

[14]

[15]

[16]

[17]

[18]

[19]

[20]

[21]

[22]

[23]

[24]

[25]

[26]

[27]

[28]

[29]

[30]

[31]

[32]

[33]

[34]

[35]

[36]

[37]

[38]

[39]

[40]

[41]

[42]

[43]

[44]

[45]

[46]

[47]

[48]

[49]

[50]

[51]

[52]

[53]

[54]

[55]

[56]

[57]

[58]

[59]

[60]

[61]

[62]

[63]

[64]

[65]

[66]

[67]

[68]

[69]

[70]

[71]

[72]

[73]

[74]

[75]

[76]

[77]

[78]

[79]

[80]

[81]

[82]

[83]

[84]

[85]

[86]

[87]

[88]

[89]

[90]

[91]

[92]

[93]

[94]

[95]

[96]

[97]

[98]

[99]

[100]

Партнерские ресурсы
Криптовалюты	Обмен криптовалют - www.bestchange.ru Криптовалютная биржа CoinEx Криптовалютная биржа Binance HIVE OS - операционная система для майнинга e4pool - Мультивалютный пул для майнинга.
Магазины	AliExpress — глобальная виртуальная (в Интернете) торговая площадка, предоставляющая возможность покупать товары производителей из КНР; computeruniverse.net - Интернет-магазин компьютеров(Промо код 5 Евро на первую покупку:FWWC3ZKQ);
Хостинг	DigitalOcean - американский провайдер облачных инфраструктур, с главным офисом в Нью-Йорке и с центрами обработки данных по всему миру;
Разное	Викиум - Онлайн-тренажер для мозга Like Центр - Центр поддержки и развития предпринимательства. Gamersbay - лучший магазин по бустингу для World of Warcraft. Ноотропы OmniMind N°1 - Усиливает мозговую активность. Повышает мотивацию. Улучшает память. Санкт-Петербургская школа телевидения - это федеральная сеть образовательных центров, которая имеет филиалы в 37 городах России. Lingualeo.com — интерактивный онлайн-сервис для изучения и практики английского языка в увлекательной игровой форме. Junyschool (Джунискул) – международная школа программирования и дизайна для детей и подростков от 5 до 17 лет, где ученики осваивают компьютерную грамотность, развивают алгоритмическое и креативное мышление, изучают основы программирования и компьютерной графики, создают собственные проекты: игры, сайты, программы, приложения, анимации, 3D-модели, монтируют видео. Умназия - Интерактивные онлайн-курсы и тренажеры для развития мышления детей 6-13 лет SkillBox - это один из лидеров российского рынка онлайн-образования. Среди партнеров Skillbox ведущий разработчик сервисного дизайна AIC, медиа-компания Yoola, первое и самое крупное русскоязычное аналитическое агентство Tagline, онлайн-школа дизайна и иллюстрации Bang! Bang! Education, оператор PR-рынка PACO, студия рисования Draw&Go, агентство performance-маркетинга Ingate, scrum-студия Sibirix, имидж-лаборатория Персона. «Нетология» — это университет по подготовке и дополнительному обучению специалистов в области интернет-маркетинга, управления проектами и продуктами, дизайна, Data Science и разработки. В рамках Нетологии студенты получают ценные теоретические знания от лучших экспертов Рунета, выполняют практические задания на отработку полученных навыков, общаются с экспертами и единомышленниками. Познакомиться со всеми продуктами подробнее можно на сайте https://netology.ru, линейка курсов и профессий постоянно обновляется. StudyBay Brazil – это онлайн биржа для португалоговорящих студентов и авторов! Студент получает уникальную работу любого уровня сложности и больше свободного времени, в то время как у автора появляется дополнительный заработок и бесценный опыт. Автор24 — самая большая в России площадка по написанию учебных работ: контрольные и курсовые работы, дипломы, рефераты, решение задач, отчеты по практике, а так же любой другой вид работы. Сервис сотрудничает с более 70 000 авторов. Более 1 000 000 работ уже выполнено. StudyBay – это онлайн биржа для англоязычных студентов и авторов! Студент получает уникальную работу любого уровня сложности и больше свободного времени, в то время как у автора появляется дополнительный заработок и бесценный опыт.